Phosphorus-containing phenolic resin, method for manufacturing the same, and use of the same
US8981014B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 16, 2014 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | May 16, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.