Patent · US Active

Modular molded interconnect devices

US8981245B2 · kind B2 · utility

8Cited by

10References

21Claims

0Family size

Inventors

Richard Hung Minh Dinh · San Jose, US
Shayan Malek · San Jose, US
Michael B. Wittenberg · Sunnyvale, US

Key dates

Filing date	Sep 4, 2012
Grant date	Mar 17, 2015
Priority date	—
Expiry date	Oct 20, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01H2205/002
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A switching subassembly includes a modular molded interconnect bracket and a switching device arranged on the modular molded interconnect bracket. The modular molded interconnect includes at least one electronic circuit trace arranged thereon configured to interconnect a portion of a flexible printed circuit board and to support a portion of the flexible printed circuit board. The switching device is configured to contact portions of the at least one electronic circuit trace.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.