Methods for controlling laser cutting processes and laser cutting systems implementing same
US8981258B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2012 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Apr 20, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser cutting processes are provided which are controlled using as a reference signal one or more emission lines which are characteristic of the radiation emitted by a gas or, more generally, by an emitting element present in the volume irradiated by the laser beam focussed by a laser head and adjusting, on the basis of this reference signal, at least one of the following process control parameters: the power of the laser, the frequency and the duty cycle of the laser pulse, the pressure of an assisting gas emitted by a nozzle forming part of the laser head, the relative speed of the laser head with respect to the workpiece, the distance between the laser head and the surface of the workpiece, and the distance between the focal point of the laser beam and the surface of the workpiece. Laser cutting devices are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.