Light emitting diode package

US8981415B1 · kind B1 · utility

Assignee

• LEXTAR ELECTRONICS CORPORATION · TW

Inventors

• Che-Ming Hsu · Gongguan, TW
• Wen-Kai Shao · New Taipei, TW
• Liang-Ta Lin · Daxi District, TW

Key dates

• Filing date: Jul 21, 2014
• Grant date: Mar 17, 2015
• Expiry date: Jul 21, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/856

Abstract

A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation space, divided by the N opaque spacers disposed on the LED chip into N+1 chambers. The N+1 encapsulating glues are filled into the N+1 chambers, where N is a natural number.