Patent · US Active

Packaging structure of a micro-device including a getter material

US8981544B2 · kind B2 · utility

1Cited by

6References

20Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Xavier Baillin · Crolles, FR
Christine Ferrandon · Saint-Égrève, FR

Key dates

Filing date	Oct 31, 2011
Grant date	Mar 17, 2015
Priority date	—
Expiry date	Oct 31, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A packaging structure including at least one cavity wherein at least one micro-device is provided, the cavity being bounded by at least a first substrate and at least a second substrate integral with the first substrate through at least one bonding interface consisting of at least one metal or dielectric material, wherein at least one main face of the second substrate provided facing the first substrate is covered with at least one layer of at least one getter material, the bonding interface being provided between the first substrate and the layer of getter material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.