Temperature control of micromachined transducers
US8981624B2 · kind B2 · utility
1Cited by
19References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 27, 2010 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Apr 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.