Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing
US8982574B2 · kind B2 · utility
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12References
12Claims
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Key dates
| Filing date | May 24, 2012 |
| Grant date | Mar 17, 2015 |
| Priority date | — |
| Expiry date | Nov 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/099
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Contactless differential coupling structures can be used to communicate signals between circuits located on separate chips or from one chip to a probing device. The contactless coupling structures avoid problems (breaks, erosion, corrosion) that can degrade the performance of ohmic-type contact pads. The contactless coupling structures comprise pairs of conductive pads placed in close proximity. Differential signals are applied across a first pair of differential pads, and the signals are coupled wirelessly to a mating pair of conductive pads. Circuitry for generating and receiving differential signals is described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.