Selectable PA bias temperature compensation circuitry

US8983407B2 · kind B2 · utility

Assignee

• RF Micro Devices, Inc. · US

Inventors

• William David Southcombe · San Diego, US
• David E. Jones · Layton, US
• Hui Liu · Marion, US
• Chris Levesque · Willow View Lane, US
• Scott Yoder · Fuquay-Varina, US
• Terry J. Stockert · Cedar Rapids, US

Key dates

• Filing date: Nov 3, 2011
• Grant date: Mar 17, 2015
• Expiry date: Nov 3, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H03F2203/7209
• WIPO field: Basic communication processes
• WIPO sector: Electrical engineering

Abstract

Radio frequency (RF) power amplifier (PA) circuitry, which transmits RF signals is disclosed. The RF PA circuitry includes a final stage, a final stage current digital-to-analog converter (IDAC), and a final stage temperature compensation circuit. A final stage current reference circuit may provide an uncompensated final stage reference current to the final stage temperature compensation circuit, which receives and temperature compensates the uncompensated final stage reference current to provide a final stage reference current. The final stage IDAC uses the final stage reference current in a digital-to-analog conversion to provide a final stage bias signal to bias the final stage. The temperature compensation provided by the final stage temperature compensation circuit is selectable.