Contact lens having an uneven embedded substrate and method of manufacture
US8985763B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2012 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Nov 14, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02C7/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Contact lenses and methods of manufacturing contact lenses are provided. In one aspect, a method includes: forming a substrate having an uneven surface; providing a sensor at a first region of the substrate; providing a chip at a second region of the substrate; and encapsulating the substrate, sensor and chip in a polymer. The method also includes: patterning interconnections from the first region of the substrate to the second region of the substrate; and patterning metal pads proximate to the second region of the substrate. The chip can be provided on a metal pad. The uneven surface can be a sloped surface or one or more sloped channels in the substrate, and the channels can be wide enough to receive interconnections for the chip and to receive the chip. Further, the substrate can be ring-shaped and curved prior to encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.