Semiconductor laser module and method for manufacturing same
US8985870B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2012 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Jun 17, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4249
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser module includes a laser diode array, an optical fiber array, a fiber array fitting for fixing the optical fiber array, a casing, and a support fitting for fixing the fiber array fitting and casing. The fiber array fitting and support fitting have a first contact section that is in line-contact or surface-contact with the plane section parallel with the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the first contact section. The support fitting and casing have a second contact section that is in line-contact or surface-contact with the plane section vertical to the light emission surface of the laser diode array, and are laser-welded and fixed to each other at the second contact section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.