Patent · US Active

Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite

US8986256B2 · kind B2 · utility

4Cited by

1References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Dick Scholten · Stuttgart, DE
Michael Stumber · Ditzingen, DE
Franz Laermer · Stuttgart, DE
Ando Feyh · Palo Alto, US

Key dates

Filing date	Oct 29, 2010
Grant date	Mar 24, 2015
Priority date	—
Expiry date	Dec 11, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T225/12
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.