MEMS package and a method for manufacturing the same
US8987030B2 · kind B2 · utility
8Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2010 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Oct 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.