Thermoplastic molding composition
US8987357B2 · kind B2 · utility
0Cited by
26References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2012 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Aug 31, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/026
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a thermoplastic molding composition comprising the following components:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.