Patent · US Active

Modification of surface energy via direct laser ablative surface patterning

US8987632B2 · kind B2 · utility

11Cited by
18References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 30, 2010
Grant dateMar 24, 2015
Priority date
Expiry dateMar 7, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24479
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Surface energy of a substrate is changed without the need for any template, mask, or additional coating medium applied to the substrate. At least one beam of energy directly ablates a substrate surface to form a predefined topographical pattern at the surface. Each beam of energy has a width of approximately 25 micrometers and an energy of approximately 1-500 microJoules. Features in the topographical pattern have a width of approximately 1-500 micrometers and a height of approximately 1.4-100 micrometers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.