Patent · US Active

Semiconductor package with integrated interference shielding and method of manufacture thereof

US8987889B2 · kind B2 · utility

8Cited by
7References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 9, 2014
Grant dateMar 24, 2015
Priority date—
Expiry dateJun 9, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3025
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.