Flexible chip set encapsulation structure
US8987890B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2013 |
| Grant date | Mar 24, 2015 |
| Priority date | — |
| Expiry date | Sep 10, 2033 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2007/0088
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A flexible chip set encapsulation structure includes a chip set. The chip set comprises a plurality of spaced chips and a fixing film. The fixing film is adapted to wrap and fix the chips. The fixing film has at least one bending portion at a predetermined position for the fixing film to have flexibility in a predetermined direction. Thus, the flexible chip set encapsulation structure is flexible for bending. When the user wears the flexible chip set, the movement of the user won't be confined. Besides, the chip set is completely attached to the body to provide a comfortable wear, and the chips provide a better far infrared radiation effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.