Implantable medical device header

US8989872B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• Jeevan M. Prasannakumar · Circle Pines, US
• Christopher M. Haenisch · Fridley, US
• David Bates · Fayetteville, US
• John C. Olson · Maple Grove, US
• George Patras · Greenfield, US
• Yanzhu Zhao · Blaine, US
• Jason P. Weiand · Rockford, US

Key dates

• Filing date: Nov 14, 2012
• Grant date: Mar 24, 2015
• Expiry date: Dec 8, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49117
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.