Method of bonding a metal to a substrate
US8992696B2 · kind B2 · utility
7Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2011 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | May 18, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of bonding a metal to a substrate involves forming a plurality of nano-features in a surface of the substrate, where each nano-feature is chosen from a nano-pore and/or a nano-crevice. In a molten state, the metal is over-cast onto the substrate surface, and penetrates the nano-features. Upon cooling, the metal is solidified inside the nano-features, where the solidification of the metal forms a mechanical interlock between the over-cast metal and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.