Method for coating a substrate in a vacuum chamber having a rotating magnetron
US8992742B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2010 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | Sep 11, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a method for coating a substrate in a vacuum chamber having a rotating magnetron, wherein a substrate is guided past the magnetron in a substrate transport direction and is coated by a material, which has been isolated from a target connected to the magnetron, and, optionally with the material reacting with a reactive gas present in the vacuum chamber, homogeneity of the coating layer on a substrate is improved by stabilizing the working point by way of the target rotation. This is achieved in that a periodic change of a first process parameter caused by the target revolution is compensated for by a periodic change of a second process parameter having a determined level and/or by employing two magnetrons having different rotational speeds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.