Patent · US Active

Method for coating a substrate in a vacuum chamber having a rotating magnetron

US8992742B2 · kind B2 · utility

1Cited by
8References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 28, 2010
Grant dateMar 31, 2015
Priority date
Expiry dateSep 11, 2030

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C14/54
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

In a method for coating a substrate in a vacuum chamber having a rotating magnetron, wherein a substrate is guided past the magnetron in a substrate transport direction and is coated by a material, which has been isolated from a target connected to the magnetron, and, optionally with the material reacting with a reactive gas present in the vacuum chamber, homogeneity of the coating layer on a substrate is improved by stabilizing the working point by way of the target rotation. This is achieved in that a periodic change of a first process parameter caused by the target revolution is compensated for by a periodic change of a second process parameter having a determined level and/or by employing two magnetrons having different rotational speeds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.