Methods for passivating metallic implantable medical devices including radiopaque markers
US8992761B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 13, 2012 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | Apr 17, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04C2270/041
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present disclosure is directed to methods of manufacturing and passivating stents and other implantable medical devices including one or more attached radiopaque markers. In one embodiment, the method includes providing a metallic implantable medical device body without any radiopaque marker(s) attached thereto, primary electropolishing the device body without any markers attached thereto, attaching one or more radiopaque markers to the device body, and lightly electropolishing the device including device body and attached radiopaque markers. Light electropolishing removes no more than about 5 percent by weight of the device (i.e., the device body and attached marker(s)). Light electropolishing passivates the exposed surfaces of the device body and markers, while also providing electropolishing to the region of any welds where the radiopaque marker(s) attach to the device body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.