Patent · US Active

Method for making a reinforced silicon micromechanical part

US8992784B2 · kind B2 · utility

1Cited by
2References
4Claims
0Family size

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Inventor

Key dates

Filing dateJul 20, 2010
Grant dateMar 31, 2015
Priority date—
Expiry dateOct 20, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49986
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method of fabricating a reinforced silicon micromechanical part includes: micro-machining the part, or a batch of parts in a silicon wafer; forming a silicon dioxide layer over the entire surface of the part, in one or plural operations, so as to obtain a thickness of silicon dioxide that is at least five times greater than the thickness of native silicon dioxide; and removing the silicon dioxide layer by etching.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.