Multilayer ceramic substrate and method for producing the same
US8993105B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 2010 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | Jan 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
When a multilayer ceramic substrate with a cavity is reduced in thickness, a bottom wall portion defining the bottom of the cavity is reduced in thickness, thereby leading to the problem that the bottom wall portion is likely to be broken. A bottom wall portion defining a cavity of a multilayer ceramic substrate has a stack structure formed with a high thermal expansion coefficient layer sandwiched between first and second low thermal expansion coefficient layers. This configuration generates compression stress in the low thermal expansion coefficient layers during a cooling process after firing, thereby allowing the mechanical strength at the bottom wall portion to be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.