Method for forming sputter target assemblies having a controlled solder thickness
US8993122B2 · kind B2 · utility
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14References
15Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 26, 2012 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | Nov 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12931
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.