Deposition of phosphor on die top by stencil printing
US8993358B2 · kind B2 · utility
4Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2011 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | Feb 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0361
Abstract
A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes disposing a stencil over the template and the plurality of LED dies. The stencil has a plurality of openings configured to expose a top surface of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the stencil and the template.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.