Circuit system in a package
US8994157B1 · kind B1 · utility
6Cited by
24References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 27, 2011 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | May 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit packaging system allows a combination of integrated circuit dice and surface mount electronic components to be mounted on a printed circuit board which is in turn mounted on a lead frame and encapsulated, thus providing an environmentally sealed package which is manufactured using standard circuit fabrication methods and machinery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.