Semiconductor packages usable with a mobile device
US8994169B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2012 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | Jun 7, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.