Electronic device housing and assembly method
US8995125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Mar 31, 2015 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a first housing of a single piece of material that has first and second spaced apart major walls that extend in lateral directions and at least three side walls extending perpendicular to the lateral directions between the major walls. The major walls and the side walls define an internal cavity, and the first housing defines an opening to the internal cavity opposite one of the side walls. At least one support member is within the internal cavity of the first housing adjacent a major walls a side wall thereof. At least one electronic component is contained within the internal cavity, and a first cover is removably affixed over the opening. At least one of the support member and the first cover contributes to a retention force applied on the at least one electronic component within the internal cavity of the first housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.