EMI-preventing socket and manufacturing method thereof
US8997345B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Jan 20, 2012 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Apr 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for an EMI-preventing socket comprises the following steps of providing an EMI-preventing element and a plurality of pins, wherein at least one of the pins is a ground pin; connecting the EMI-preventing element to the ground pin via a direct physical connection; providing a mold; placing the EMI-preventing element, the ground pin and the remaining pins of the plurality of pins in the mold, wherein the EMI-preventing element surrounds the pins in the mold; and providing a molding material into the mold to cover the plurality of pins and to cover a joint of the EMI-preventing element and the ground pin to form a socket body of the EMI-preventing socket. Parts of the EMI-preventing element and one end of each of the plurality of pins is exposed out of the socket body of the EMI-preventing socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.