Wire loop forming systems and methods of using the same
US8998063B2 · kind B2 · utility
0Cited by
10References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2013 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Jan 22, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/904
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.