Apparatus and method utilizing forced convection for uniform thermal treatment of thin film devices
US8998606B2 · kind B2 · utility
1Cited by
149References
23Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 4, 2012 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Jun 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/324
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for uniform reactive thermal treatment of thin-film materials includes a chamber enclosing a tube shaped space filled with a work gas and heaters disposed outside the chamber. The apparatus further includes a loading configuration for subjecting a plurality of planar substrates to the work gas in the tube shaped space. Baffles are disposed above and below the loading configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.