Etching or plating process and resist ink
US8999185B2 · kind B2 · utility
2Cited by
11References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2007 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Jan 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a process of etching or plating comprising the steps of: i) ink jet printing an alkali removeable water insoluble hot melt ink jet ink onto a substrate to form a resist image; ii) etching or plating the substrate in an aqueous acid medium; and iv) removing the resist image with an aqueous alkali.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.