Cover tape, method for manufacturing cover tape, and electronic part package
US8999502B2 · kind B2 · utility
0Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2010 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Aug 25, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2817
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cover tape having a temperature at which a heat shrinkage rate in at least one of a machine direction and a transverse direction perpendicular to the machine direction is 5% or more between 80° C. to 200° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.