Process for encapsulating a micro-device by attaching a cap and depositing getter through the cap
US8999762B2 · kind B2 · utility
2Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2012 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | May 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for encapsulating a micro-device in a cavity formed between a first and a second substrate is provided, including producing the micro-device in or on the first substrate; attaching and securing the second substrate to the first substrate, thereby forming the cavity in which the micro-device is placed; producing at least one hole through one of the two substrates, leading into the cavity opposite a portion of the other of the two substrates; depositing at least one getter material portion through the hole on said portion of the other of the two substrates; and hermetically sealing the cavity by closing the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.