Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
US9000473B2 · kind B2 · utility
4Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2011 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | May 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.