Patent · US Active

Interlayer communications for 3D integrated circuit stack

US9000577B2 · kind B2 · utility

9Cited by

3References

14Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Guido Droege · Braunschweig, DE
Niklas Linkewitsch · Evessen, DE
Andre Schaefer · Hersbruck, DE

Key dates

Filing date	Sep 30, 2011
Grant date	Apr 7, 2015
Priority date	—
Expiry date	Sep 30, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/06544
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Some embodiments provide capacitive AC coupling inter-layer communications for 3D stacked modules.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.