MEMS microphone package with molded interconnect device
US9002038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2013 |
| Grant date | Apr 7, 2015 |
| Priority date | — |
| Expiry date | Sep 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone package is described that includes a plastic lid, a substrate base, and two electrical components. The plastic lid includes a first conductive lid trace and the substrate base includes a first conductive substrate trace. The plastic lid is sealably coupled to the substrate base to form a sealed cavity. The substrate trace and the lid trace are arranged such that, when the cavity is sealed, an electrical connection is formed between the substrate trace and the lid trace. The first component is mounted on the substrate base and electrically coupled to the substrate trace. The second component is mounted on the lid and is electrically coupled to the lid trace. The electrical connection between the substrate trace and the lid trace provides electrical coupling between the first component and the second component. At least one of the first component and the second component includes a MEMS microphone die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.