Method for making a magnetically coupled thin-wafer handling system
US9003642B2 · kind B2 · utility
0Cited by
3References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 30, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Mar 30, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5313
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention describes a method of and an apparatus for including: separating magnets and corresponding target plates; separating a lower support assembly from an upper retainer assembly of a thin-wafer handling system; and inserting or removing a thin wafer from the thin-wafer handling system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.