Method for the production of a ceramic multilayer circuit arrangement
US9003653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2008 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Oct 3, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a ceramic multilayer circuit system, and a corresponding multilayer circuit system are provided. An embodiment of the method includes sequential deposition of a plurality of circuit layers of the multilayer circuit system on a substrate using a powder spray method; pressing of the deposited plurality of circuit layers; and thermal sintering of the pressed plurality of circuit layers. The individual circuit layers have electrically conductive areas made of at least one conductive material and electrically insulating areas made of at least one ceramic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.