Patent · US Active

Thermal mass flowmeter with a metal-encapsulated sensor system

US9003876B2 · kind B2 · utility

0Cited by
7References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 29, 2011
Grant dateApr 14, 2015
Priority date
Expiry dateApr 30, 2033

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01F1/684
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A thermal mass flowmeter with a metal-encapsulated sensor system is provided. The sensor system included at least one heating resistor having a platelet geometry, and a sensor cap surrounding the at least one heating resistor. At least one distal end area of the sensor cap is formed with a flat rectangular cross section corresponding to the platelet geometry of the heating resistor, such that the distal end area of the sensor cap surrounds the heating resistor closely with an accurate fit (e.g., with a predetermined gap therebetween).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.