Thermal mass flowmeter with a metal-encapsulated sensor system
US9003876B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2011 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Apr 30, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F1/684
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal mass flowmeter with a metal-encapsulated sensor system is provided. The sensor system included at least one heating resistor having a platelet geometry, and a sensor cap surrounding the at least one heating resistor. At least one distal end area of the sensor cap is formed with a flat rectangular cross section corresponding to the platelet geometry of the heating resistor, such that the distal end area of the sensor cap surrounds the heating resistor closely with an accurate fit (e.g., with a predetermined gap therebetween).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.