Process for depositing films simultaneously onto both sides of a substrate
US9005718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2009 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jul 29, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/365
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for the simultaneous deposition of films onto both sides of a substrate (2), which comprises in particular introducing a substrate (2) into a reaction chamber (106, 206) or making said substrate run therethrough, in which chamber at least two electrodes (110, 210) are placed. At least one dielectric barrier (14, 114) is placed between these at least two electrodes (110, 210). An adjustable inductor (L) is placed in the secondary circuit of the transformer in parallel with the circuit comprising the at least two electrodes. A high-frequency electrical voltage is generated, said voltage being such that it generates a filamentary plasma (112, 212) on each side of the substrate between the at least two electrodes (110, 210).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.