Patent · US Active

Process for depositing films simultaneously onto both sides of a substrate

US9005718B2 · kind B2 · utility

0Cited by
6References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 16, 2009
Grant dateApr 14, 2015
Priority date
Expiry dateJul 29, 2032

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC03C2218/365
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A process for the simultaneous deposition of films onto both sides of a substrate (2), which comprises in particular introducing a substrate (2) into a reaction chamber (106, 206) or making said substrate run therethrough, in which chamber at least two electrodes (110, 210) are placed. At least one dielectric barrier (14, 114) is placed between these at least two electrodes (110, 210). An adjustable inductor (L) is placed in the secondary circuit of the transformer in parallel with the circuit comprising the at least two electrodes. A high-frequency electrical voltage is generated, said voltage being such that it generates a filamentary plasma (112, 212) on each side of the substrate between the at least two electrodes (110, 210).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.