Techniques for processing a substrate using a mask
US9006688B2 · kind B2 · utility
2Cited by
20References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2010 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Apr 7, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2457
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Herein, an improved technique for processing a substrate is disclosed. In one particular exemplary embodiment, the technique may be achieved using a mask for processing the substrate. The mask may be incorporated into a substrate processing system such as, for example, an ion implantation system. The mask may comprise a first base; and a plurality of fingers spaced apart from one another to define one or more gaps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.