Light emitting diode carrier
US9006770B2 · kind B2 · utility
1Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2011 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jun 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.