Solid-state image sensing device and camera
US9006807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2013 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Apr 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
According to one embodiment, a solid-state image sensing device includes a semiconductor substrate having a first and second surface, an insulating film covering an element on the first surface, a pixel array including pixels configured to photoelectrically convert light applied on the side of the second surface, contact regions in the semiconductor substrate, one or more through-electrodes respectively provided in the contact regions, and first pads provided on the side of the second surface to correspond to the respective contact regions. The first pad extends in a first direction from the contact regions toward the pixel array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.