Sensor module for accommodating a pressure sensor chip and for installation into a sensor housing

US9006847B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Aline Welter · Eisenach, DE
• Alexander Lux · Esslingen am Neckar, DE
• Christoph Gmelin · Stuttgart, DE
• Jens Vollert · Östringen, DE
• Reinhold Herrmann · Stuttgart, DE
• Eckart Schellkes · Kirchentellinsfurt, DE

Key dates

• Filing date: Jul 20, 2011
• Grant date: Apr 14, 2015
• Expiry date: Oct 9, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

In a sensor module for accommodating a pressure sensor chip and for installation into a sensor housing, a module wall is connected monolithically to the module bottom and surrounds the pressure sensor chip. Multiple connecting elements which are conducted through the module wall to the outside run straight at least in the entire outside area. Furthermore, the connecting elements are exposed on their top and bottom sides for affixing and electrically connecting at least one electrical component and for electrically integrating the sensor module into the sensor housing. In this way, a two-sided use of a sensor module having an identical external geometry and identical connectors is possible.