Patent · US Active

Encapsulation of an MEMS component and a method for producing said component

US9006868B2 · kind B2 · utility

1Cited by

4References

7Claims

0Family size

Assignee

EPCOS AG · DE

Inventors

Christian Bauer · Neu-Ulm, DE
Hans Kruger · Birkenfeld, DE
Jürgen Portmann · Munich, DE
Alois Stelzl · Munich, DE

Key dates

Filing date	Nov 18, 2011
Grant date	Apr 14, 2015
Priority date	—
Expiry date	Dec 16, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.