Patent · US Active

Package for a micro-electro mechanical device

US9006877B2 · kind B2 · utility

0Cited by

4References

5Claims

0Family size

Assignee

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. · US

Inventors

Don Michael · Monmouth, US
Mari J. Rossman · Corvallis, US
Bradley A. Bower · Junction City, US
Charles C. Haluzak · Corvallis, US
John R. Sterner · Albany, US
Quan Qi · Beaverton, US
John P. Kane · Tafton, US

Key dates

Filing date	Oct 31, 2008
Grant date	Apr 14, 2015
Priority date	—
Expiry date	Jun 4, 2029

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C1/00269
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.