Piezoelectric active cooling device
US9006956B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Sep 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and devices for providing cooling for a mobile device using piezoelectric active cooling devices. Some embodiments utilize piezoelectric actuators that oscillate a planar element within an air channel to fan air within or at an outlet of the air channel. The air channel may be defined by at least one heat dissipation surface in thermal contact with components of the mobile device that generate excess waste heat. For example, the air channel may include a surface that is in thermal contact with a processor of the mobile computing device. In embodiments, the piezoelectric active cooling device may be used in an air gap between stacked packages in a package on package (PoP) processor package. The described embodiments provide active cooling using low power, can be controlled to provide variable cooling, use highly reliable elements, and can be implemented at low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.