Housing unit with heat sink
US9007773B2 · kind B2 · utility
10Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jul 13, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Described herein is an apparatus for dissipating or transferring heat from electronics secured in a housing unit. A housing unit includes a cover having a first fastener part and a base having a second fastener part. The base further includes a support structure for holding a printed circuit board (PCB) with mounted electronic components. A heat sink is placed within the base. The first fastener part and the second fastener part lock the cover and base together, with the heat sink and the PCB being secured between the support structure and the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.