Board module and fabrication method thereof
US9007777B2 · kind B2 · utility
1Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2010 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Jun 15, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.