Silicon-based lens support structure and cooling package with passive alignment for compact heat-generating devices
US9008147B2 · kind B2 · utility
0Cited by
9References
14Claims
0Family size
Inventors
Key dates
| Filing date | May 6, 2013 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | May 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4031
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A silicon-based thermal energy transfer apparatus that aids dissipation of thermal energy from a heat-generating device, such as an edge-emitting laser diode, is provided. In one aspect, the apparatus comprises a base portion and a support portion. The base portion is made of silicon and includes a first primary surface. The first primary surface includes at least first and second V-notch grooves thereon. The support portion is made of silicon and includes at least first and second edges that are interlockingly received in the first and second V-notch grooves when the support portion is mounted on the base portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.